PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING

摘要

Solder bump connections and methods for fabricating solder bump connections. A passivation layer is formed on a dielectric layer. A via opening extends through the passivation layer from a top surface of the passivation layer to a metal line in the dielectric layer. A mask on the top surface of the passivation layer includes a mask opening that is aligned with the via opening. A conductive layer is selectively formed in the via opening and the mask opening. The conductive layer projects above the top surface of the passivation layer. The method further includes planarizing the passivation layer and the conductive layer to define a plug in the via opening that is coupled with the metal line.

主权项

1. A method of fabricating a solder bump connection, the method comprising:
forming a passivation layer on a dielectric layer; forming a via opening extending through the passivation layer from a top surface of the passivation layer to a metal line in the dielectric layer; forming a mask on the top surface of the passivation layer and having a mask opening aligned with the via opening; selectively forming a conductive layer in the via opening and the mask opening that projects above the top surface of the passivation layer; and planarizing the passivation layer and the conductive layer to define a plug in the via opening that is coupled with the metal line.