| 摘要 |
Provided are an underfill capable of suppressing void generation, and a method for manufacturing a semiconductor device in which the underfill is used. An underfill (20) containing an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, having a storage modulus of at least 3000 Pa when mounted, and having a lowest melt viscosity temperature of 125°C or less is affixed in advance onto a semiconductor chip (10) on which a soldered electrode is formed, and mounted on a circuit board (30) on which a counter electrode facing the soldered electrode is formed. The semiconductor chip (10) and the circuit board (30) are bonded by thermocompression. |
