Solder and Lead Free Electronic Circuit and Method of Manufacturing Same

摘要

An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

主权项

1. An electronic circuit, comprising:
a circuit board having conducting tracks; at least one electronic component having a top surface, a bottom surface and conducting contacts positioned overlying portions of the conducting tracks; a clamp that is in contact with the top surface and applies a force to the top surface of the at least one electronic component to hold the conducting contacts in electrical contact with the conducting tracks; and at least one lead wire that forms a first electrical contact between at least one conducting track of the circuit board and a first electrical component, said lead wire being held in place through a mechanical fit in the absence of any solder; wherein the conducting tracks are in electrical contact with the bottom surface of the component and electrical contact between the conducting tracks and the bottom surface is maintained in the absence of any solder; and wherein the clamp is comprised of a rigid clamping sheet and at least one fastener that secures the clamping sheet to the circuit board.