Semiconductor package And Method Of Fabricating The Same

摘要

The present invention provides a semiconductor package and a manufacturing method thereof. The method for manufacturing the semiconductor package includes the steps of: mounting a first semiconductor chip which includes a chip region, a heat transfer region and a bottom heat transfer pattern arranged on the heat transfer region on a substrate; mounting a second semiconductor chip on the chip region of the first semiconductor chip; forming a mold layer to surround the first semiconductor chip and the second semiconductor chip on the substrate; forming an opening part to expose the bottom heat transfer pattern in the mold layer; forming a heat path pattern in the opening part; and forming a heat discharge part which is connected to the heat path pattern on the second semiconductor chip and the mold layer.