Semiconductor package and method for manufacturing the same

摘要

The present invention relates to a semiconductor package and a method for manufacturing the same. More particularly, the present invention relates to a semiconductor package and a method for manufacturing the same capable of realizing a structure of laminating a plurality of chips using a through silicon via and a fan out structure using a redistribution process. Also, the present invention provides a semiconductor package and a method for manufacturing the same capable of reducing a manufacturing cost by excluding a substrate and reducing the whole package thickness by laminating an upper chip and a lower chip by using a through silicon via and forming an input/output pad to which electric signals of the upper chip and the lower chip are input/output on the lower chip and the surface of a molding compound resin around the lower chip by using the redistribution process.