发明名称 |
METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE |
摘要 |
<p>A silicon carbide substrate (90) having a surface (SO) is prepared. A coating film (50) made of a first material is formed directly on the surface (SO) of the silicon carbide substrate (90). A mask layer (31) made of a second material is formed on the coating film (50). The first material is higher in adhesiveness with silicon carbide than the second material. A first opening (P1) is formed in the mask layer (31). First impurity ions for providing a first conductivity type are implanted into the silicon carbide substrate (90) by using ion beams (J1) passing through the first opening (P1) in the mask layer (31) and through the coating film (50).</p> |
申请公布号 |
EP2747128(A4) |
申请公布日期 |
2015.03.18 |
申请号 |
EP20120826064 |
申请日期 |
2012.07.09 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
OOI, NAOKI |
分类号 |
H01L21/04;H01L21/265;H01L21/266;H01L21/336;H01L29/12;H01L29/78 |
主分类号 |
H01L21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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