| 发明名称 |
COMPOSITE FOR REDIATION OF HEAT AND PRINTED CIRCUIT BOARD USING THE SAME |
| 摘要 |
<p>The purpose of the present invention is to provide a thermal radiation composition and a thermal radiation layer using the same. According to an embodiment of the present invention, the thermal radiation composition comprises 0.01 to 750 parts by weight of an inorganic filler based on 100 parts by weight of a binder composition, wherein the binder composition comprises 50 to 500 parts by weight of alkoxy silane based on 100 parts by weight of alumina sol.</p> |
| 申请公布号 |
KR20150029446(A) |
申请公布日期 |
2015.03.18 |
| 申请号 |
KR20130108663 |
申请日期 |
2013.09.10 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
LEE, HYUN KI;GIL, GUN YOUNG;YUN, SUNG JIN;CHUNG, HEE YOUNG |
| 分类号 |
C09K5/10;H05K1/02 |
主分类号 |
C09K5/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
