| 摘要 |
<p>The present invention relates to a substrate processing apparatus. The substrate processing apparatus according to one embodiment of the present invention includes a cleaning chamber which cleans foreign materials on a substrate and a recycling unit which collects and recycles mixture solutions including a first chemical solution and a second chemical solution used for cleaning a substrate. The recycling unit includes a recycling assembly which decompresses the mixture solutions by process pressure and separates the mixture solutions into the first chemical solution and the second chemical solution, and a temperature control assembly which is located between the cleaning chamber and the recycling assembly, reduces the temperature of the mixture solution supplied to the recycling assembly than a bumping temperature to generate a bumping phenomenon in the process pressure and supplies the mixture solution with the reduced temperature to the recycling assembly.</p> |
