| 摘要 |
<p>An electronic-circuit-component mounting system is provided which is capable of mounting an electronic circuit component supplied from an improved component holder having high density of arrangement of components. A tray support table 140 supports multi-component arranged trays 100B, 100C having a plurality of unit spaces 170 defined repeatedly according to a first rule, and in each of the plurality of unit spaces 170 a plurality of electronic circuit components 172 are held in a plurality of states defined according to a second rule. A vacuum nozzle is controlled to take the electronic circuit components 172 one by one from the multi-component arranged trays 100B, 100C and mount the components 172 onto a circuit board. By establishing a state in which the plurality of electronic circuit components 172 arranged in each unit space 170 are different in rotation orientation from each other, density of arrangement of components can be made higher when compared with a conventional technique in which the rotation orientation is the same in all the unit spaces. It is noted that the electronic-circuit-component mounting system is capable of mounting the components, taking the difference in rotation orientation into consideration.</p> |
