| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer processing method capable of easily dividing a wafer into several devices without deteriorating a quality of a device even when a wafer is processed to be thin. <P>SOLUTION: The method includes: a step for grinding a circular recess part 88 having a ring-like reinforcing part 90 around a rear surface of a wafer; a step for forming a plurality of devices blocked by a predetermined division line formed like a lattice on a surface of a wafer corresponding to the circular recess part; a step for attaching an outer periphery of a dicing tape T adhering to the wafer surface to an annular frame F; a step for radiating lasers transmissive to the wafer from a rear surface and focusing them inside the wafer in a device region to form a modified layer; a step for holding the wafer rear surface and radiating the lasers while a focus point is positioned inside the ring-like reinforcing part on an extension line of the predetermined division line from the dicing tape side to form a modified layer inside the ring-like reinforcing part; and a step for applying an external force to the wafer and dividing the wafer into several devices along the predetermined division line. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
