| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high reliability adhesive for electronic parts which can suppress void generation and attains a low coefficient of linear expansion after being cured. <P>SOLUTION: The adhesive for electronic parts contains an epoxy compound, a benzoxazine compound, a phenolic curing agent and an acid anhydride curing agent. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
