| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology for reducing variation in thickness of a mold layer which coats a component packaging surface even without grinding resin by suppressing flow of uncured resin to a center part of an aggregate substrate when thermal curing is performed. <P>SOLUTION: Since a mold layer 4 is divided and formed by filling a smaller amount of resin than in the conventional case to a component packaging surface 2a of an aggregate substrate 10, separately, for each of a first resin layer 6 and a second resin layer 7, even when a warp is generated on the aggregate substrate 10 due to contraction of the resin when each of the first resin layer 6 and the second resin layer 7 is thermally cured, since the amount of the resin filled on the component packaging surface 2a is smaller than in the conventional case, flow of the first resin and the second resin which are uncured to the center part of the aggregate substrate 10 is suppressed, and variation in thickness of the mold layer 4 which coats the component packaging surface 2a is reduced even without grinding the thermally cured resin. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
