| 摘要 |
<p>The present invention relates to a method of manufacturing a substrate. An aspect of the present invention is to manufacture a substrate used in semiconductor related fields. The present invention relates to the method of manufacturing the substrate, in which during processes of sequential loading, machining (rough machining, semi-rough machining, finish machining) and measuring, an ABB process or a sanding work (pre-annealing process) is performed in advance as a pre-processing process, while an aging process by a racking process is added, and a post-process of the ABB process or the sanding work is reworked so that a thermal variation of a material is extremely minimized and a precise usability is guaranteed thereby significantly improving the quality of the material.</p> |
