发明名称 高速回復整流器構造体の装置および方法
摘要 <p>An apparatus and method for a fast recovery rectifier structure. Specifically, the structure includes a substrate of a first dopant. A first epitaxial layer lightly doped with the first dopant is coupled to the substrate. A first metallization layer is coupled to the first epitaxial layer. A plurality of trenches is recessed into the first epitaxial layer, each of which is coupled to the metallization layer. The device also includes a plurality of wells each doped with a second dopant type, wherein each well is formed beneath and adjacent to a corresponding trench. A plurality of oxide layers is formed on walls and a bottom of a corresponding trench. A plurality of channel regions doped with the first dopant is formed within the first epitaxial layer between two corresponding wells. Each of the plurality of channel regions is more highly doped with the first dopant than the first epitaxial layer.</p>
申请公布号 JP5686824(B2) 申请公布日期 2015.03.18
申请号 JP20130000246 申请日期 2013.01.04
申请人 发明人
分类号 H01L29/47;H01L21/337;H01L21/338;H01L27/095;H01L27/098;H01L29/808;H01L29/812;H01L29/861;H01L29/868;H01L29/872 主分类号 H01L29/47
代理机构 代理人
主权项
地址