发明名称 |
Laminated chip electronic component, board for mounting the same, and packing unit thereof |
摘要 |
A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer. |
申请公布号 |
EP2849190(A1) |
申请公布日期 |
2015.03.18 |
申请号 |
EP20140187377 |
申请日期 |
2012.12.10 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD |
发明人 |
LEE, SUN CHEOL;KIM, WOO SUP;KIM, DONG GUN;KIM, KYEONG JUN;LEE, KYU HO |
分类号 |
H01G4/00;H01C7/00;H01C7/10;H01G2/06;H01G2/24;H01G4/30;H01L41/083;H05K1/03;H05K1/18 |
主分类号 |
H01G4/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|