发明名称 音響チップ
摘要 <p>A thermoacoustic chip includes a substrate, a sound wave generator, a first electrode, and a second electrode, and an integrated circuit chip. The substrate has a first surface. The sound wave generator is located on the first surface of the substrate. The first electrode and a second electrode are spaced from each other and electrically connected to the sound wave generator. The integrated circuit chip is located on the substrate and electrically connected to the first electrode and the second electrode.</p>
申请公布号 JP5685621(B2) 申请公布日期 2015.03.18
申请号 JP20130128388 申请日期 2013.06.19
申请人 发明人
分类号 H04R23/00 主分类号 H04R23/00
代理机构 代理人
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