发明名称 Sn合金めっき液への錫成分補給方法およびSn合金めっき装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method that can facilitate supply of a Sn-component to Sn-plating liquid in a tin-plating process and prevent occurrence of clouds or precipitates caused by supply of the tin component. <P>SOLUTION: Supply liquid 11 with dissolved stannous oxide powder 10 and Sn-alloy plating liquid 12 are disposed so as to be adjacent each other via a cationic exchange membrane 21. Sn-ions in the supply liquid 11 are moved into the Sn-alloy plating liquid 12 through the cationic exchange membrane 21, and insoluble substances 15 in the supply liquid 11 are collected from the supply liquid 11. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5685850(B2) 申请公布日期 2015.03.18
申请号 JP20100172002 申请日期 2010.07.30
申请人 发明人
分类号 C25D21/14 主分类号 C25D21/14
代理机构 代理人
主权项
地址