| 摘要 |
<p>The present invention relates to a sealed radiating box assembly with embedded electronic components, which is capable of efficiently cooling the electronic components by emitting heat while operating, without a cooling fan. To achieve this, the sealed radiating box assembly with embedded electronic components includes: a substrate unit having a substrate with electronic components mounted thereon, which emit heat while operating; a ceramic coating layer coated outside the substrate unit, and configured to emit far infrared rays by heat generated by the substrate unit; a sealed radiating box having an internal space where the substrate unit is mounted, and configured to emit heat to an external space while being heated by the far infrared rays. The sealed radiating box includes: a bottom frame where the substrate unit is installed; a side wall frame coupled with the bottom frame; an upper frame coupled with the side wall frame; an internal heat transfer pin formed to extend from one or more of the side wall frame and the upper frame, and to protrude to the internal space of the sealed radiating box; and an external heat dissipation pin formed to extend from one or more of the side wall frame and the upper frame, and to protrude to the external space of the sealed radiating box.</p> |
