发明名称 Printed substrate, and electronic component having shield structure
摘要 <p>A protective member (315) which has a surface which is coated with, for example, a conductive sheet or the like is carried upon the surface (311A) of the SAW filter (311) which has been mounted in the fitting region (313) upon the printed substrate (312). Here, within the conductive surface of the protective member (315), by surface contact with the surface (311A) of the SAW filter (311), the size of a conductive coating surface (315A) of the protective member which covers this surface (311A) is set so as to be the same as the size of the surface (311A) of the SAW filter (311), or to be smaller than the size thereof. Furthermore a shield frame member (316) which is shaped as a frame and which is made from a metal (for example from copper or the like) is provided so as to surround the periphery of the fitting region (313) for the SAW filter (311) and moreover a shield lid member (317) which is shaped as a lid and which is made from a metal (for examplefrom copper or the like) is provided so as to be sandwiched from both sides by the printed substrate (312). </p>
申请公布号 EP2184964(A3) 申请公布日期 2015.03.18
申请号 EP20090159298 申请日期 2003.01.23
申请人 MITSUBISHI MATERIALS CORPORATION;PANASONIC CORPORATION 发明人 YAMAGUCHI, KUNIO;KIMURA, RYOUHEI;TANAKA, ATSUSHI;MOROZUMI, KENYU
分类号 H05K1/02;H03H9/02;H03H9/10;H03H9/25;H03H9/64;H04B1/04;H04B1/10;H04B1/38;H05K1/11;H05K9/00 主分类号 H05K1/02
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