| 摘要 |
<p>The present invention relates to a method for de-bonding a device wafer and a carrier wafer and a bonding/de-bonding apparatus. The present invention reduces the device wafer from the carrier wafer without damaging the device wafer by forming a separation initiation point by reducing the adhesion of a part of the outermost side of an adhesion layer by a method like a physical external force like an insertion element to improve separation uniformity and to facilitate mutual separation at room temperature by uniformly bonding the device wafer to the carrier wafer at the same time and saves processing time.</p> |
