Laying die, laying device and method for manufacturing a laying die

摘要

The invention relates to a laying die (12) for picking up and laying of substrates, the die comprising an elastically deformable substrate receiving structure (26) for providing an engagement surface (86) for releasable receiving of substrates, an attaching element (22) comprising a gas channel (46) for providing positively or negatively pressurized gas (45) for picking up and blowing off the substrates, a carrier body (24) made from an elastically deformable material, the carrier body being sandwiched between the receiving structure and the attaching element, wherein the attaching element is arranged to distribute the gas over the carrier body, wherein the carrier body comprises a plurality of breakthroughs (34) to transfer the gas from the attaching element to the receiving structure, wherein the receiving structure comprises an elastically deformable distribution plate (70) to distribute the gas over the engagement surface.