| 摘要 |
<p>An electroless gold plating solution and a plating method thereof are provided to show less toxicity than conventional plating solutions without cyanic compounds. An electroless gold plating solution contains 0.5~10g/L of sulfurous acid gold salt converted to gold ion and 10~150g/L of water-soluble amino carboxylic acid compound. The electroless gold plating solution does not include any sulfurous acids except for the sulfurous acid gold salt. Wiring(7) is composed of a wiring pattern(3) and a gold-plated film(5). The wiring pattern made of copper is formed on a substrate(1) or a wafer. The gold-plated film directly coats the wiring patterns.</p> |
