| 摘要 |
Provided is a light-emitting diode device comprising: a substrate, a plurality of light-emitting diode devices, at least one contact light-emitting diode unit, a plurality of conductive wiring structures, and a first electrode pad, wherein: the substrate has a first surface; the light-emitting diode units are formed on the first surface, and any one of the light-emitting diode units has an area and includes a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; the contact light-emitting diode unit is formed on the first surface, has an area, and includes a first semiconductor layer, a second semiconductor layer formed on the first semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; the conductive connecting structures connect the light-emitting diode units and the contact light-emitting diode unit; the first electrode pad is formed on the contact light-emitting diode unit; and the area of the contact light-emitting diode unit is larger than the area of at least one adjacent light-emitting diode unit. |
