| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer processing method capable of easily dividing a wafer into several devices without deteriorating a quality of a device even when a wafer is processed to be thin. <P>SOLUTION: The method includes: a step for grinding and forming a circular recess part having a ring-like reinforcing part 90 on a rear surface of a wafer; a step for forming devices at a plurality of regions blocked by a predetermined division line formed like a lattice on a surface of a wafer corresponding to the circular recess part; a step for attaching an outer periphery of a dicing tape T adhering to the wafer surface to an annular frame F; a step for focusing and radiating laser lights transmissive to the wafer from a rear surface of the wafer inside the predetermined division line to form a modified layer; a step for focusing and radiating the laser lights inside a boundary portion of the circular recess part and the ring-like reinforcing part from the rear surface of the wafer to form the modified layer inside the boundary portion, and then cutting and removing the ring-like reinforcing part from the circular recess part; and a step for dividing the wafer into several devices along the predetermined division line. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
