发明名称 METAL-CERAMIC BONDED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
摘要 A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.
申请公布号 EP2680678(A4) 申请公布日期 2015.03.18
申请号 EP20110861583 申请日期 2011.03.29
申请人 DOWA METALS & MINING CO., LTD. 发明人 OSANAI, HIDEYO;TAKAHASHI, TAKAYUKI;IDEGUCHI, SATORU;KOTANI, HIROTAKA
分类号 H05K1/02;H05K1/03 主分类号 H05K1/02
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