发明名称 |
DICING BEFORE GRINDING AFTER COATING |
摘要 |
<p>This invention is a method for singulating a semiconductor wafer into individual semiconductor dies, the top surface of the semiconductor wafer bumped with metallic pre-connections and having a coating of underfill disposed over and around the metallic pre-connection bumps. The method comprises (A) providing a semiconductor wafer having a top surface with an array of metallic pre-connection bumps and a coating of underfill disposed over and around the metallic pre-connection bumps; (B) dicing through the underfill between the metallic pre-connection bumps and into the top surface of the semiconductor wafer to the ultimate desired wafer thickness, creating dicing lines; and (C) removing wafer material from the backside of the wafer at least to the depth of the dicing lines, thus singulating the resulting dies from the wafer.</p> |
申请公布号 |
EP2737522(A4) |
申请公布日期 |
2015.03.18 |
申请号 |
EP20120820834 |
申请日期 |
2012.07.25 |
申请人 |
HENKEL IP & HOLDING GMBH |
发明人 |
HOANG, GINA;KIM, YOUNSANG;GUINO, ROSETTE;HUANG, QIAOHONG |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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