发明名称 Selectable PA bias temperature compensation circuitry
摘要 Radio frequency (RF) power amplifier (PA) circuitry, which transmits RF signals is disclosed. The RF PA circuitry includes a final stage, a final stage current digital-to-analog converter (IDAC), and a final stage temperature compensation circuit. A final stage current reference circuit may provide an uncompensated final stage reference current to the final stage temperature compensation circuit, which receives and temperature compensates the uncompensated final stage reference current to provide a final stage reference current. The final stage IDAC uses the final stage reference current in a digital-to-analog conversion to provide a final stage bias signal to bias the final stage. The temperature compensation provided by the final stage temperature compensation circuit is selectable.
申请公布号 US8983407(B2) 申请公布日期 2015.03.17
申请号 US201113288318 申请日期 2011.11.03
申请人 RF Micro Devices, Inc. 发明人 Southcombe William David;Jones David E.;Liu Hui;Levesque Chris;Yoder Scott;Stockert Terry J.
分类号 H04B1/04;H01Q11/12;H03F3/19;H03F3/217;H03F3/24;H03F1/30;H03F3/72 主分类号 H04B1/04
代理机构 Withrow & Terranova, P.L.L.C. 代理人 Withrow & Terranova, P.L.L.C.
主权项 1. Circuitry comprising: a final stage temperature compensation circuit adapted to provide temperature compensation for an uncompensated final stage reference current to provide a final stage reference current, such that the temperature compensation is selectable; a final stage current digital-to-analog converter (IDAC) adapted to use the final stage reference current in a digital-to-analog conversion to provide a final stage bias current to bias a final stage; and the final stage adapted to receive and amplify a radio frequency (RF) input signal to provide an RF output signal.
地址 Greensboro NC US