发明名称 |
Method for cleaning a contact pad of a microstructure and corresponding cantilever contact probe and probe testing head |
摘要 |
A method for cleaning a contact pad of a microstructure or device to be tested when it is in electric contact with a measure apparatus, being obtained by electrically contacting a flexible probe with said contact pad. The method includes mechanically engaging a free end of the flexible probe in a manner that sticks the free end in the pad; and laterally flexing, by a tip charge, the flexible probe in a manner that keeps the free end stuck in the pad, so as to locally dig into a covering layer of the pad and realize a localized crushing thereof. |
申请公布号 |
US8981803(B2) |
申请公布日期 |
2015.03.17 |
申请号 |
US201213661980 |
申请日期 |
2012.10.26 |
申请人 |
Technoprobe S.p.A. |
发明人 |
Vettori Riccardo |
分类号 |
G01R31/02;G01R1/067;G01R31/28 |
主分类号 |
G01R31/02 |
代理机构 |
Seed IP Law Group PLLC |
代理人 |
Seed IP Law Group PLLC |
主权项 |
1. A method for cleaning a contact pad of a microstructure or device to be tested, the device to be tested being in electric contact with a measure apparatus and comprising at least a flexible probe, the flexible probe electrically contacting the contact pad, the method comprising:
mechanically engaging a free end of the flexible probe in a manner that sticks the free end in the pad; and laterally flexing, by a tip charge, the flexible probe in a manner that keeps the free end stuck in the pad, the free end of the flexible probe being pointed and locally digging into a covering layer of the pad and realizing a localized crushing of the covering layer. |
地址 |
Cernusco Lombardone IT |