发明名称 |
Light emitting diode package with lens and method for manufacturing the same |
摘要 |
A light emitting diode (LED) package includes a substrate with a flat top surface, an LED chip mounted on the substrate, and a group of blocking structure and encapsulation body. The LED chip electrically connects with the substrate. The blocking structure surrounds the LED chip. The encapsulation body covers the LED chip. A bottom of the encapsulation body is enclosed by the blocking structure; the encapsulation body has a light outputting surface, and an outer surface of the blocking structure is continuously connected with the light outputting surface. The light outputting surface has a semispherical profile. An angle between a normal line extending from the outer surface of the blocking structure and perpendicular to the substrate and a tangent line tangent to the light outputting surface at a point thereof adjacent to the outer surface is smaller than 60 degrees. |
申请公布号 |
US8981407(B2) |
申请公布日期 |
2015.03.17 |
申请号 |
US201313919755 |
申请日期 |
2013.06.17 |
申请人 |
Advanced Optoelectronic Technology, Inc. |
发明人 |
Chang Chung-Min;Chang-Chien Chien-Lin;Hu Hsuen-Feng;Tsai Yu-Wei;Sun Chang-Wen |
分类号 |
H01L33/00;H01L33/60 |
主分类号 |
H01L33/00 |
代理机构 |
Novak Druce Connolly Bove + Quigg LLP |
代理人 |
Novak Druce Connolly Bove + Quigg LLP |
主权项 |
1. A light emitting diode package, comprising:
a substrate having a flat top surface; a light emitting diode chip mounted on the top surface of the substrate and electrically connecting with the substrate; a blocking structure formed on the substrate and surrounding the light emitting diode chip therein, a metal layer covering surfaces of the blocking structure to perform as a light reflecting layer; and an encapsulation body formed on the substrate to encapsulate the light emitting diode chip therein, a bottom of the encapsulation body being enclosed by the blocking structure, the encapsulation body having a light outputting surface, and an outer surface of the blocking structure being continuously connected with the light outputting surface, wherein the encapsulation body comprises a light outputting surface, the blocking structure comprising a resisting surface, the resisting surface being the outer surface of the blocking structure, a normal line being defined extending from the resisting surface and being perpendicular to the substrate, a tangent line being defined tangent to the light outputting surface at a point thereof adjacent to the resisting surface, and an angle between the normal line and the tangent line is being smaller than 60 degrees. |
地址 |
Hsinchu Hsien TW |