| 发明名称 | Carrier-attached copper foil | ||
| 摘要 | The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr layer containing 10-100 μg/dm2 of Cr is provided. | ||
| 申请公布号 | US8980414(B2) | 申请公布日期 | 2015.03.17 |
| 申请号 | US201213823349 | 申请日期 | 2012.08.30 |
| 申请人 | JX Nippon Mining & Metals Corporation | 发明人 | Nagaura Tomota;Sakaguchi Kazuhiko |
| 分类号 | B32B15/00;B32B15/20;H05K1/09;B32B15/01;C25D1/04;C25D3/04;C25D3/12;C25D3/38;C25D3/58;C25D5/14;C25D7/06;C25D9/08;C23C28/02 | 主分类号 | B32B15/00 |
| 代理机构 | Drinker Biddle & Reath LLP | 代理人 | Drinker Biddle & Reath LLP |
| 主权项 | 1. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate layer is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr-containing layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr-containing layer containing 10-100 μg/dm2 of Cr, wherein said Cr-containing layer further contains Zn. | ||
| 地址 | Tokyo JP | ||