Semiconductor device and method of manufacturing the same

摘要

According to one embodiment, a semiconductor device in which CNTs are used for a contact via comprise a substrate including a contact via groove, a catalyst layer for CNT growth which is formed at the bottom of the groove, and a CNT via formed by filling the CNTs into the groove in which the catalyst layer is formed. Each of the CNTs is formed by stacking a plurality of graphene layers in a state in which they are inclined depthwise with respect to the groove, and formed such that ends of the graphene layers are exposed on a sidewall of the CNT. Further, the CNT is doped with at least one element from the sidewall of the CNT.

主权项

1. A semiconductor device, comprising:
a substrate comprising a contact via groove; a catalyst layer for carbon nanotube growth which is formed on a bottom surface of the groove; and a carbon nanotube via which is embedded in the groove in which the catalyst layer is formed, and formed by a plurality of carbon nanotubes,wherein:
each of the plurality of carbon nanotubes is formed such that a plurality of graphene layers are stacked in a state in which they are inclined depthwise with respect to the groove, and ends of the graphene layers are exposed on a sidewall of each of the plurality of carbon nanotubes, and the carbon nanotubes are doped with at least one element from the exposed ends of the graphene layers, said exposed ends of the graphene layers being a doping path on the sidewall of each of the plurality of carbon nanotubes.