发明名称 |
Method and structure for a micro-mechanical device containing liquid thereon |
摘要 |
The present invention discloses an adhesive-free method for preparation of micro electro-mechanical structure, comprising forming a micro electro-mechanical structure on a first substrate, forming an enclosing space for immersing liquid on the first or second substrate, and applying pressure to fix the first and second substrate. Before applying the pressure, the assembly including the two substrates is flipped, to make the contact surface immersed by the immersing liquid. |
申请公布号 |
US8980669(B2) |
申请公布日期 |
2015.03.17 |
申请号 |
US201314078598 |
申请日期 |
2013.11.13 |
申请人 |
Sagatek Co., Ltd. |
发明人 |
Chen Jung-Hsiang;Chen Cheng-Szu;Chen Bo-Ting |
分类号 |
H01L21/00;H01L21/30;B81C3/00 |
主分类号 |
H01L21/00 |
代理机构 |
Bacon & Thomas, PLLC |
代理人 |
Bacon & Thomas, PLLC |
主权项 |
1. A method for preparation of a micro electro-mechanical structure, comprising the steps of:
forming a micro electro-mechanical structure on a first substrate; forming partition walls on the first substrate, to define an enclosing space containing the micro electro-mechanical structure; introducing a fluid into the enclosing space; covering the enclosing space with a second substrate; flipping the assembly including the first and second substrates, so that contact surface of the partition walls and the second substrate is positioned below a surface of the fluid; and applying a pressure to the first and second substrates to weld the contact surface. |
地址 |
Taipei TW |