| 发明名称 | Method of fabricating sensors having functionalized resonating beams | ||
| 摘要 | Some embodiments relate to method of fabricating a sensor. The method includes providing a substrate wafer that includes a suspended beam; adding an adhesive layer to the substrate wafer such that the adhesive layer covers portions of the substrate without covering the suspended beam; positioning a cover wafer onto the adhesive layer such that the suspend beam is exposed to ambient air through openings in the cover wafer; and functionalizing the suspended beam by contacting the suspended beam with materials through the opening in the cover wafer. | ||
| 申请公布号 | US8980666(B2) | 申请公布日期 | 2015.03.17 |
| 申请号 | US201113308878 | 申请日期 | 2011.12.01 |
| 申请人 | Honeywell Romania s.r.l. | 发明人 | Cobianu Cornel P. |
| 分类号 | H01L21/00;G01N29/02;G01N29/22;B81C1/00;B01L3/00;B82Y40/00 | 主分类号 | H01L21/00 |
| 代理机构 | Schwegman Lundberg & Woessner, P.A. | 代理人 | Schwegman Lundberg & Woessner, P.A. |
| 主权项 | 1. A method of fabricating a sensor comprising: providing a substrate wafer that includes a suspended beam; adding an adhesive layer to the substrate wafer such that the adhesive layer covers portions of the substrate without covering the suspended beam; positioning a cover wafer onto the adhesive layer such that the suspend beam is exposed to ambient air through openings in the cover wafer; and functionalizing the suspended beam by contacting the suspended beam with materials through the opening in the cover wafer. | ||
| 地址 | RO | ||