| 发明名称 | Silicon based capacitive microphone | ||
| 摘要 | A silicon based capacitive microphone includes a printed circuit board, a shell mounted on the printed circuit board and forming a receiving space together with the printed board, a chamber support located on top of the printed circuit board and received in the receiving space, a transducer unit and a controlling chip respectively mounted on the chamber support, wherein the chamber support forms a first chamber together with the printed board, the chamber support includes an opening, the transducer unit is provided with a second chamber and covers the opening, the second chamber communicates with the first chamber via the opening. | ||
| 申请公布号 | US8983107(B2) | 申请公布日期 | 2015.03.17 |
| 申请号 | US201313771138 | 申请日期 | 2013.02.20 |
| 申请人 | AAC Acoustic Technologies (Shenzhen) Co., Ltd. | 发明人 | Liu Guojun |
| 分类号 | H04R9/08;H04R11/04;H04R25/00;G01L9/00;H04R19/00;H04R1/02;H04R1/04;B81B7/00;H04R19/04;H04R1/08;B81B3/00 | 主分类号 | H04R9/08 |
| 代理机构 | Anova Law Group, PLLC | 代理人 | Anova Law Group, PLLC |
| 主权项 | 1. A silicon based capacitive microphone, comprising: a printed circuit board; a shell mounted on the printed circuit board and forming a receiving space together with the printed circuit board; a chamber support located on top of the printed circuit board and received in the receiving space; a transducer unit and a controlling chip respectively mounted on the chamber support; wherein the chamber support forms a first chamber together with the printed board, the chamber support includes an opening, the transducer unit is provided with a second chamber and covers the opening, and the second chamber communicates with the first chamber via the opening, a plurality of leakage holes communicating with the first chamber is formed on the chamber support. | ||
| 地址 | Shenzhen CN | ||