Cutting fluids with improved performance

摘要

The cutting of semiconducting crystals with a wire saw is facilitated with a cutting fluid comprising a polyalkylene glycol neutralized with an un-neutralized or partially neutralized polymeric acid that has a molecular weight of 500 to 1,000,000 and contains more than three acid groups per molecule.

主权项

1. A polyalkylene glycol product obtainable by polymerization of alkylene oxide using a base catalyst, wherein the base catalyst and polyalkylene glycol are neutralized with an un-neutralized or partially neutralized polymeric acid that has a molecular weight of 500 to 1,000,000 and contains more than three acid groups per molecule, wherein the polymeric acid is selected from the group consisting of polyalkylene oxide radically grafted by one or more of acrylic acid, methacrylic acid, maleic acid, styrene sulfonic acid, 2-acrylamido-2-methylpropyl sulfonic acid; a homo- or copolymer of acrylic acid, methacrylic acid, maleic acid, styrene sulfonic acid, or 2-acrylamido-2-methylpropyl sulfonic acid; a homo- or copolymer of acrylic acid, methacrylic acid, maleic acid, styrene sulfonic acid, or 2-acrylamido-2-methylpropyl sulfonic acid that is grafted with a polyalkylene oxide or a mono-alkyl or aryl ether of polyalkylene oxide; and combinations thereof.