Defect estimation device and method and inspection system and method

摘要

Acquired mask data of a defect portion is sent to a simulated repair circuit 300 to be simulated. The simulation of the acquired mask data 204 is returned to the mask inspection results 205 and thereafter sent to a wafer transfer simulator 400 along with a reference image at the corresponding portion. A wafer transfer image estimated by the wafer transfer simulator 400 is sent to a comparing circuit 301. When it is determined that there is a defect in the comparing circuit 301, the coordinates and the wafer transfer image which is a basis for the defect determination are stored as transfer image inspection results 206. The mask inspection results 205 and the transfer image inspection result 206 are then sent to the review device 500.

主权项

1. An inspection device, which irradiates light to a sample formed with a pattern, forming an image of the sample on an image sensor through an optical system, and determines the presence of a defect, comprising:
an optical image acquisition part which obtains an optical image of the sample from the image sensor; a first comparison part which compares the optical image with a reference image as a reference of the determination and, when a difference exceeds at least one of threshold values, determines that there is a defect; a transfer image estimation part which estimates by simulation an optical image obtained when each pattern of an optical image on the sample and the reference image is transferred by a transfer device; and a second comparison part which compares each of the transfer images and when a difference exceeds at least one of the threshold values, determines that there is a defect.