| 发明名称 | Substrate mounting and demounting method | ||
| 摘要 | A substrate mounting and demounting method that can prevent fine particles from getting stuck in a rear surface of a substrate. A substrate processing apparatus that implements the substrate mounting and demounting method has an electrostatic chuck that has therein an electrode plate to which a DC voltage is applied, and attracts and holds a substrate through an electrostatic force generated due to the applied DC voltage, and a heat-transmitting gas supply unit that supplies a heat-transmitting gas into a gap between the attracted and held substrate and the electrostatic chuck. When the DC voltage applied to the electrode plate is increased while being gradually changed, the pressure of the supplied heat-transmitting gas is increased in stages in response to the increase in the DC voltage. | ||
| 申请公布号 | US8982529(B2) | 申请公布日期 | 2015.03.17 |
| 申请号 | US201113049340 | 申请日期 | 2011.03.16 |
| 申请人 | Tokyo Electron Limited | 发明人 | Kobayashi Yoshiyuki |
| 分类号 | H01L21/683;H01L21/67 | 主分类号 | H01L21/683 |
| 代理机构 | Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A substrate mounting method implemented by a substrate processing apparatus, which has an electrostatic chuck that has therein an electrode plate, said mounting method comprising: applying a DC voltage to the electrode plate; attracting and holding a substrate through an electrostatic force generated due to the applied DC voltage; supplying with a heat-transmitting gas supply unit a heat-transmitting gas into a gap between the attracted and held substrate and the electrostatic chuck; and during mounting the substrate to the electrostatic chuck, when increasing the DC voltage applied to the electrode plate while gradually changing the same, increasing a pressure of the supplied heat-transmitting gas in a staircase pattern in response to the increase in the DC voltage. | ||
| 地址 | Tokyo JP | ||