发明名称 |
Printed circuit board |
摘要 |
A printed circuit board includes a line intensive distribution area, a line sparse distribution area, a solder mask layer, and a signal layer. A first signal line is laid on the signal layer. The first signal line crosses the line intensive distribution area and the line sparse distribution area. The first signal line is narrower in the line intensive distribution area than in the line sparse distribution area. The solder mask layer is thicker in the line intensive distribution area than in the line sparse distribution area. |
申请公布号 |
US8981236(B2) |
申请公布日期 |
2015.03.17 |
申请号 |
US201213730874 |
申请日期 |
2012.12.29 |
申请人 |
Hong Fu Jin Precision Industry (WuHan) Co., Ltd.;Hon Hai Precision Industry Co., Ltd. |
发明人 |
Zhang Feng |
分类号 |
H05K1/00;H05K1/03;H05K1/02;H05K3/34 |
主分类号 |
H05K1/00 |
代理机构 |
Novak Druce Connolly Bove + Quigg LLP |
代理人 |
Novak Druce Connolly Bove + Quigg LLP |
主权项 |
1. A printed circuit board, comprising:
a line intensive distribution area and a line sparse distribution area; a solder mask layer; and a signal layer having a first signal line laid thereon; wherein the first signal line crosses the line intensive distribution area and the line sparse distribution area, the first signal line is narrower in the line intensive distribution area than in the line sparse distribution area, and the solder mask layer is thicker in the line intensive distribution area than in the line sparse distribution area. |
地址 |
Wuhan CN |