Manufacturing method of wafer level package

摘要

The present invention provides a method for manufacturing a semiconductor package structure, including (i) providing a carrier plate; (ii) disposing a die on the carrier plate; (iii) forming a plurality of bonding wires having a first end and a second end; (iv) forming an encapsulant covering the die and the bonding wires and exposing a portion of each of the bonding wires from a first surface thereof; (v) removing the carrier plate; (vi) forming a patterned conductive layer on a second surface of the encapsulant opposite to the first surface; (vii) electrically connecting the second ends of the bonding wires to the active surface of the die via the patterned conductive layer; and (viii) forming a plurality of first external connection terminals on the first surface of the encapsulant respectively covering the portions of the bonding wires exposed from the encapsulant.

主权项

1. A method for manufacturing a semiconductor package structure, comprising:
providing a carrier plate; disposing a die on the carrier plate, wherein the die comprises an active surface and a back surface opposite to the active surface, and the active surface is attached to the carrier plate; forming a plurality of bonding wires, wherein each of the bonding wires has a first end and a second end opposite to the first end, the first end is connected to the back surface of the die, and the second end is connected to the carrier plate; forming an encapsulant covering the die and the bonding wires, wherein a portion of each of the bonding wires is exposed from a first surface of the encapsulant; removing the carrier plate; forming a patterned conductive layer on a second surface of the encapsulant opposite to the first surface; electrically connecting the second ends of the bonding wires to the active surface of the die via the patterned conductive layer; and forming a plurality of first external connection terminals on the first surface of the encapsulant, wherein the first external connection terminals respectively cover the portions of the bonding wires exposed from the first surface of the encapsulant, and are electrically connected to the bonding wires.