发明名称 Electronic device
摘要 An electronic device includes a printed circuit board that has a prohibited region, in which arrangement of a wiring pattern is prohibited, in a fixed region from an outer periphery, an electronic component mounted on the printed circuit board, a heat dissipation fin provided on the electronic component, and a fixing unit that is made of a conductive material and fixes the heat dissipation fin by pressing the fin against the printed circuit board side, wherein a notch is formed in two sides of the printed circuit board that face each other with the electronic component therebetween, and the fixing unit exerts an elastic force that presses the heat dissipation fin against the printed circuit board side by being locked to the notch and is such that hook portions locked to the notch are arranged in the prohibited region.
申请公布号 US8982564(B2) 申请公布日期 2015.03.17
申请号 US201114110622 申请日期 2011.06.29
申请人 Mitsubishi Electric Corporation 发明人 Nishihara Noboru;Tatsuyama Koichi;Mihara Hiroshi
分类号 H05K7/20;H05K1/02;H01L23/40 主分类号 H05K7/20
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC ;Turner Richard C.
主权项 1. An electronic device comprising: a printed circuit board that has a prohibited region in which arrangement of a wiring pattern is prohibited, the prohibited region being formed to be directly adjacent to an edge of the printed circuit board; an electronic component mounted on the printed circuit board; a heat dissipation fin provided on the electronic component; and a fixing unit that fixes the heat dissipation fin by pressing the heat dissipation fin against the printed circuit board side, wherein the fixing unit exerts an elastic force that presses the heat dissipation fin against the printed circuit board side by being locked to a notch formed in the prohibited region of the printed circuit board, a hook portion of the fixing unit that is locked to the notch is arranged in the prohibited region, and the notch extends from the edge of the printed circuit board into the prohibited region.
地址 Tokyo JP