Semiconductor package structure

摘要

A semiconductor package structure includes: a dielectric layer; a metal layer disposed on the dielectric layer and having a die pad and traces, the traces each including a trace body, a bond pad extending to the periphery of the die pad, and an opposite trace end; metal pillars penetrating the dielectric layer with one ends thereof connecting to the die pad and the trace ends while the other ends thereof protruding from the dielectric layer; a semiconductor chip mounted on the die pad and electrically connected to the bond pads through bonding wires; and an encapsulant covering the semiconductor chip, the bonding wires, the metal layer, and the dielectric layer. The invention is characterized by disposing traces with bond pads close to the die pad to shorten bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging encountered in prior techniques.

主权项

1. A semiconductor package structure, comprising:
a dielectric layer having a third surface and an opposite fourth surface, wherein the third surface has a die mounting area and a plurality of contact pad areas; a plurality of traces disposed on the third surface, the traces each comprising a trace body, a bond pad extending into the die mounting area, and a trace end opposite to the bond pad; a plurality of metal pillars penetrating the third surface and the fourth surface of the dielectric layer, wherein an end of each of the metal pillars is exposed from the third surface and connected to the trace ends, the other ends of the metal pillars protrude from the fourth surface, and the metal pillars have continuous side surfaces that extend from the respective ends to the other ends; a semiconductor chip mounted on the bond pads and electrically connected to the traces; and an encapsulant covering and being in direct contact with all top and side surfaces of the semiconductor chip, the traces, and the third surface of the dielectric layer.