Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements

摘要

A package stack structure may an upper package include an upper package substrate having a first edge and a second edge opposite to the first edge. The upper package substrate has a first region arranged near the first edge and a second region arranged near the second edge. A first upper semiconductor device is mounted on the upper package substrate. The package stack structure may also include a lower package having a lower package substrate and a lower semiconductor device. The lower package is connected to the upper package through a plurality of inter-package connectors. The plurality of the inter-package connectors may include first inter-package connectors configured to transmit data signals; second inter-package connectors configured to transmit address/control signals; third inter-package connectors configured to provide a supply voltage for an address/control circuit; and fourth inter-package connectors configured to provide a supply voltage for a data circuit.

主权项

1. A semiconductor package comprising:
a semiconductor device on a package substrate, the semiconductor device comprising a first edge and a second edge opposite to the first edge, and a first region arranged near the first edge and a second region arranged near the second edge; and a plurality of bonding pads on the semiconductor device, wherein the plurality of the bonding pads comprise:
first bonding pads disposed in the first region, the first bonding pads configured to transmit data signals;second bonding pads disposed in the first region, the second bonding pads configured to transmit address/control signals; andthird bonding pads disposed in the second region, the third bonding pads configured to provide a supply voltage for an address/control circuit.