发明名称 Bipolar transistor with low resistance base contact and method of making the same
摘要 Embodiments of the present invention provide a bipolar transistor with low resistance base contact and method of manufacturing the same. The bipolar transistor includes an emitter, a collector, and an intrinsic base between the emitter and the collector. The intrinsic base extends laterally to an extrinsic base. The extrinsic base further includes a first semiconductor material with a first bandgap and a second semiconductor material with a second bandgap that is smaller than the first bandgap.
申请公布号 US8981430(B2) 申请公布日期 2015.03.17
申请号 US201213710953 申请日期 2012.12.11
申请人 International Business Machines Corporation 发明人 Pagette Francois;Schonenberg Kathryn T.
分类号 H01L29/73;H01L29/66;H01L29/10;H01L29/737;H01L29/08 主分类号 H01L29/73
代理机构 Roberts Mlotkowski Safran & Cole, P.C. 代理人 Cai Yuanmin;Roberts Mlotkowski Safran & Cole, P.C.
主权项 1. A method of manufacturing a bipolar transistor, the method comprising: providing a semiconductor substrate as a collector; forming an intrinsic base on said semiconductor substrate; forming an extrinsic base on an outer portion of said intrinsic base, said extrinsic base having a first layer of a first semiconductor material; forming an emitter on an inner portion of said intrinsic base, said emitter being separated from said extrinsic base by one or more sets of spacers; forming a second layer of a second semiconductor material of said extrinsic base, said second semiconductor material having a smaller bandgap than that of said first semiconductor material; forming a first set of tunable non-conductive sidewall spacers defining edges of said extrinsic base away from said emitter and directly on said first semiconductor material; forming a recessed portion of said first semiconductor material such that a surface of said first semiconductor adjacent to said first set of tunable non-conductive sidewall spacers has an upper surface at a lower height than a surface under said first set of tunable non-conductive sidewall spacers; and forming said second semiconductor material directly on the upper surface of said recessed portion of said first semiconductor material.
地址 Armonk NY US