Efficient substrate heat transfer layer for photonic devices

摘要

Embodiments of the invention describe substrates, used to form optical devices, which include high thermal conductivity intermediate layers. Said substrates comprise a bulk layer, an optical device layer comprising a first material, and an intermediate layer disposed between the bulk layer and the device layer comprising a second material having a higher thermal conductivity and a lower index of refraction than the first material.;In the resulting devices, said intermediate layer functions as part of the device layer structure—i.e., provides optical or electrical power dissipation (i.e. thermal) functionality for the device formed from said substrate. Thus, optical devices do not necessarily need to utilize an add-on packaging solution for heat absorption when formed from substrate stacks according to embodiments of the invention. Moreover, in some embodiments, said intermediate layer is located at “zero-distance” from the source of the heat generation, thereby efficiently transferring heat out of that region.

主权项

1. A substrate comprising:
a bulk layer; an optical device layer disposed above the bulk layer formed from a first material comprising a low loss material at optical wavelengths and including a waveguiding region; and an intermediate layer disposed on and above the bulk layer and below the device layer comprising a second material, different than the first material, having a higher thermal conductivity and a lower index of refraction than the first material and for distributing heat from the optical device layer to the bulk layer and for vertically confining the waveguiding region of the optical device layer, the intermediate layer to at least vertically confine an optical mode of an optical waveguide formed by the optical device layer.