| 发明名称 | Through-holed interposer, packaging substrate, and methods of fabricating the same | ||
| 摘要 | A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer. | ||
| 申请公布号 | US8981570(B2) | 申请公布日期 | 2015.03.17 |
| 申请号 | US201313845625 | 申请日期 | 2013.03.18 |
| 申请人 | Unimicron Technology Corporation | 发明人 | Tseng Tzyy-Jang;Hu Dyi-Chung;Chan Ying-Chih |
| 分类号 | H01L23/48;H01L21/768;H01L21/56;H01L23/31;H01L25/065;H01L23/00 | 主分类号 | H01L23/48 |
| 代理机构 | Mintz Levin Cohn Ferris Glovsky and Popeo, P.C. | 代理人 | Mintz Levin Cohn Ferris Glovsky and Popeo, P.C. ;Corless Peter F.;Jensen Steven M. |
| 主权项 | 1. A through-holed interposer, comprising: a board body having opposing first and second surfaces and a plurality of through holes connecting the first surface and the second surface; a conductive gel formed in each of the through holes and having a first end protruded from the first surface of the board body; and a circuit redistribution structure disposed on the second surface of the board body and a second end of the conductive gel and electrically connected to the second end of the conductive gel, wherein the circuit redistribution structure has a redistribution circuit layer that is in contact with the second end of the conductive gel, and the redistribution circuit layer is free from contacting the second surface of the board body. | ||
| 地址 | Taoyuan TW | ||