Heating apparatus for heating electronic components on a printed circuit board in low temperature environment

摘要

A heating apparatus for heating electronic components on a printed circuit board in low temperature environment includes a printed circuit board, a heating unit, a switch unit, a temperature-sensing unit, an electric power unit, and a control unit. The heating unit, the switch unit, the temperature-sensing unit, and the control unit are fixed connected to the printed circuit board and are electrically connected with the metal lines on the printed circuit board. The heat source is sent to the heat-conducting layer on the printed circuit board through the heat-conducting terminal after the switch unit is conducted by the control unit and the power is sent from the electric power unit to the heating unit. Then, the electronic components are heated with the heat source through the heat-conducting layer, so that the electronic components are in the working temperatures for starting up.

主权项

1. A heating apparatus for heating electronic components (11) on a printed circuit board (1) in low temperature environment, the heating apparatus heating a plurality of electronic components (11) mounted on the printed circuit board (1), the heating apparatus including:
a printed circuit board (1) comprising a plurality of metal lines (12) connecting the electronic components (11), and comprising a heat-conducting layer (14) under the electronic components (11); and a heating unit (2) arranged on the printed circuit board (1) and connected to the metal lines (12) and the heat-conducting layer (14), wherein heat is transmitted from the heating unit (2) to the heat-conducting layer (14) after the heating unit (2) is started to heat; the electronic components (11) are heated with the heat source through the heat-conducting layer (14), so that the electronic components (11) are in the working temperatures for starting up, wherein the printed circuit board (1) is a multi-layer printed circuit board (7), and wherein the multi-layer printed circuit board (7) includes a first insulation layer (71), a bottom circuit layer (72), an electric power circuit layer (73), a second insulation layer (74), a grounding circuit layer (75), a third insulation layer (76), and a top circuit layer (77), wherein the bottom circuit layer (72) includes the heat-conducting layer (14); the bottom circuit layer (72) is under the first insulation layer 71; the electric power circuit layer (73) is above the first insulation layer (71); the second insulation layer (74) is above the electric power circuit layer (73); the grounding circuit layer (75) is above the second insulation layer (74); the third insulation layer (76) is above the grounding circuit layer (75); the top circuit layer (77) includes the heat-conducting layer (14); the top circuit layer (77) is above the third insulation layer (76).