The following inspection method that was attached to the polyimide film from device attach to polyimide film of PCB

摘要

The present invention relates to an inspection method after attaching polyimide film to a polyimide film attaching device of a printed circuit board which can improve productivity by allowing a user to watch and grasp whether a tape is properly attached to a PCB at a glance through a monitor. The inspection method after attaching polyimide film to a polyimide film attaching device of a printed circuit board according to the present invention comprises: a tape transfer step (S10); an attachment step (S20) of storing error information of a head in a memory unit (81), and displaying the error information in an operation information section (76) of a monitor (70); a photographing step (S30) storing photographing information in the memory unit (81); a calculation step (S40) displaying a head number and displaying errors of calculation information using colors if an error is detected in the operation information section (76) of the monitor (70); and a correction step (S50) applying offset to a relevant head and correcting the head when an offset application is clicked.