Bonded microelectromechanical assemblies

摘要

A MEMS device is described that has a body with a component bonded to the body. The body has a main surface and a side surface adjacent to the main surface and smaller than the main surface. The body is formed of a material and the side surface is formed of the material and the body is in a crystalline structure different from the side surface. The body includes an outlet in the side surface and the component includes an aperture in fluid connection with the outlet.

主权项

1. An assembly, comprising:
a body having a main surface and a first side surface adjacent to the main surface and in a plane different from a plane of the main surface, the first side surface being nonparallel to the main surface and being smaller than the main surface, wherein the body is formed of silicon and the first side surface is formed of silicon, and wherein the silicon in the body is in a form of crystalline silicon, and the silicon in the first side surface is in a form of polysilicon; a component bonded to the first side surface with an adhesive, wherein the body includes an outlet in the first side surface and the component includes an aperture in fluid connection with the outlet; an actuator disposed on an exterior of the main surface adjacent to a chamber; and a manifold attached to a second side surface, the crystalline structure of the body is different from the second side surface, the manifold configured to supply fluid to the assembly.