发明名称 WIRING BOARD AND ELECTRONIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a wiring board capable of achieving favorable electrical connection between penetrating conductors formed in a thickness direction of an insulating layer along a side of a through hole having a square shape in a planar view.SOLUTION: A wiring board 1 of the present invention includes: an insulating substrate 11 comprising a plurality of insulating layers laminated therein and having a through hole 12 having a square shape in a planar view; and a plurality of penetrating conductors 14 disposed along a square-shaped side that forms an external shape and penetrating through the insulating layers. Each of the penetrating conductors 14 includes a first penetrating conductor 141 and a second penetrating conductor 142. The first penetrating conductor 141 and the second penetrating conductor 142 are formed in the insulating layers located vertically, respectively, to be connected with each other. The second penetrating conductor 142 has a longer length in a direction orthogonal to the side than the first penetrating conductor 141.</p>
申请公布号 JP2015050313(A) 申请公布日期 2015.03.16
申请号 JP20130180780 申请日期 2013.08.31
申请人 KYOCERA CORP 发明人 TAKAHASHI TORU;MORIYAMA YOSUKE
分类号 H05K3/46;H05K1/02;H05K1/11;H05K3/40 主分类号 H05K3/46
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