发明名称 |
COOLING THERMOELECTRIC MOUDULE AND DEVICE USING THE SAME |
摘要 |
The embodiments of the present invention relates to a thermoelectric module used for cooling. Electrical properties are improved by enlarging at least one volume opposite to each other in a unit cell of a thermoelectric semiconductor device, thereby providing a thermoelectric module having a structure for improving cooling efficiency. |
申请公布号 |
KR20150028577(A) |
申请公布日期 |
2015.03.16 |
申请号 |
KR20130107384 |
申请日期 |
2013.09.06 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
KIM, SANG GON;CHO, YONG SANG;WON, BOO NE;LEE, HYUNG EUI |
分类号 |
H01L35/02;H01L35/34 |
主分类号 |
H01L35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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